GLC · Full sponsorship
Yayasan Telekom Malaysia Scholarship 2026
Provider: Yayasan Telekom Malaysia
- Funds
- Degree
- Covers
- Full sponsorship (TM bond typical)
- Who's eligible
- See foundation — Recurring annually.
- When to apply
- Last closing date we recorded: 13 April 2026 (now passed). The cycle usually opens in April. Check the official page.
Deadlines, grade requirements and amounts shift every cycle. Always confirm the live details on each official source before you apply. Checked on 2026-08-23.
Quick answers
Who is eligible for Yayasan Telekom Malaysia Scholarship 2026?
See foundation — Recurring annually. Confirm on the sponsor's official page.
What does Yayasan Telekom Malaysia Scholarship 2026 cover?
Full sponsorship (TM bond typical). Confirm on the sponsor's official page.
Does Yayasan Telekom Malaysia Scholarship 2026 have a bond?
Yes. Under its official terms, the award comes with a service bond or repayment obligation. Read the bond terms before accepting an offer.
When do applications for Yayasan Telekom Malaysia Scholarship 2026 open?
The last closing date we recorded is 13 April 2026. The cycle usually opens in April. Confirm on the sponsor's official page.
Which fields of study does Yayasan Telekom Malaysia Scholarship 2026 fund?
By the terms we checked on 23 August 2026, the sponsor limits this award to engineering and IT and computer science. Confirm on the sponsor's official page.